Brian Cohn

Managed a team of approximately eight people, including substantial facility modification, equipment selection, installation, and prove out of line to do roll-to-roll manufacturing of touch panel components—developed low-volume assembly capability in the United States and high volume capability in China.

Managed a cross-functional 12 person team including mechanical, electrical, embedded software, manufacturing engineers, procurement specialists, and a marketing team to upgrade a line of controllers for the control of off-highway vehicles such as tractors and wheel loaders. Four basic designs and seven variants were developed over two years. The project included phasing out an older product line and working with OEM customers to upgrade to the newer platform.

Managed a cross-functional team of ten optical, mechanical, electrical, and firmware engineers to create a novel 3D sensor that could measure the location of a flip chip or ball grid array component when on the nozzle of a pick and place machine. The sensor measured the height of the solder balls to ensure that all would make contact in the reflow process. The sensor was developed from concept to working prototype, including sourcing custom optical components in eight months and commissioning with a customer in Japan.